From 28.02.2023 to 02.03.2023, everything revolved around the topic of printed electronics at the Munich trade fair. Suppliers, customers and scientists exchanged views on innovations and market trends. It is becoming increasingly clear that products with printed functional layers from the laboratory are now entering the market ready for series production following preliminary development.
The possible applications are diverse. From sensors in mechanical engineering for predictive maintenance purposes to display technology for smartphones and medical home care, products can be manufactured using the printing process. These are characterised above all by weight savings and flexibility.
Consequently, this is also reflected in the economic outlook for this year. In contrast to the general trend, the industry is expecting a significant increase in turnover of 18 per cent according to the OE-A (Association for Printed Electronics).
New exhibition stand and new products
The binder ITZ also presented innovative products in the current trade fair design. This year, the focus was on measurement and sensor technology. A newly developed force-sensitive sensor (FSR) was exhibited for the first time. Interested visitors were able to test these applications for themselves at the newly designed trade fair stand.
In the field of printed electronics, binder also offers customised solutions for touch, temperature and force sensors. These are printed directly onto three-dimensional and structured surfaces using a printing process specially developed by binder ITZ. In principle, a variety of surfaces can thus be provided with cost-effective functional layers. A trend that was also reflected at this year's trade fair under the term ‘function everywhere’.
In addition to printed functional layers, there was also increased demand for connection technologies. Here, binder was able to fully utilise its core expertise as a specialist in circular connectors, as most applications in the field of printed electronics are so-called hybrid systems. Here, printed components are combined with conventional electronics. In order to be able to safely combine the two worlds, binder offers special solutions in the field of contacts and connectors as well as soldering, bonding and crimping technology.
Innovations thanks to a good network
The binder ITZ is already using printed, conductive copper-based layers. These can be contacted directly using a classic soldering process. In line with the industry as a whole, binder ITZ's pastes are also becoming increasingly ready for series production. LOPEC is therefore also an excellent opportunity to cultivate contacts with suppliers. Future developments could also be discussed in talks with key suppliers. Thanks to binder ITZ's good networking in the industry, innovations continue to emerge that benefit our customers.
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Facts about LOPEC 2023
- Leading global trade fair for printed electronics
- 168 exhibitors from 25 countries (62 per cent from abroad)
- 2,300 visitors from 43 countries (57 per cent from abroad)
- In addition to Germany, the top five visitor countries included France, Austria, the UK and Finland