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Printing process

Our goal is  to explore new avenues in printing technology. The printing system developed by binder allows functional layers, such as electrodes or conductor tracks, to be applied directly to three-dimensionally shaped or structured surfaces. The process is suitable for substrates such as plastic, metal, glass, ceramics and much more.

Pad printing

  • Format: 16 x 16 cm
    Layer thicknesses: 2-50 µm
    Edge sharpness < 5µm
  • Line structures <80 µm

Screen printing

  • Format: 20 x 20 cm
    Layer thicknesses: 20-400 µm
  • Line structures
    < 60 µm

Dispense

  • Conductor pressure
  • Rapid prototyping
  • Directly solderable contacting
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