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Research and development

Printed electronics

Printing electrical components, the future technology of the 21st century!
Through the binder process different electrical components can be produced using printing technology!

At binder, we are breaking new ground in electronics production.

As a circular connector manufacturer, binder has expanded its core expertise in recent years to include printed electronics. This offers the possibility of producing printed sensors, printed heaters, printed conductor tracks, etc. With specially researched and developed printing processes and a high level of vertical integration, binder products can be customised to meet individual customer requirements.  all from one source.

Through direct printing, binder functionalises existing mechanics and can make them intelligent or speak for themselves.

The ITZ works permanently with university partners and partner companies to generate innovative solutions to challenges that arise in printed electronics and the overall product.

Development partner

Institut für Druckmaschinen und Druckverfahren
Technische Universität Darmstadt
S1|10 203
Magdalenenstr. 2
64289 Darmstadt
Technische Universität Darmstadt
Integrierte Elektronische Systeme
Merckstr. 25
64283 Darmstadt
Karlsruher Institut für Technologie
Lichttechnisches Institut
Engesserstrasse 13
76131 Karlsruhe
Hochschule Reutlingen
Fakultät Textil & Design
Alteburgstraße 150
72762 Reutlingen
Hochschule für Technik, Wirtschaft und Kultur Leipzig
Karl-Liebknecht-Str. 132
042777 Leipzig

Organisations

TechnologyMountains e.V
c/o IHK Schwarzwald-Baar-Heuberg
Romäusring 4, 78050 Villingen-Schwenningen
T +49 7721 922-511
F +49 7721 922-9511
microTEC Südwest e.V.
Emmy-Noether-Straße 2
79110 Freiburg
T +49 761 386909-0
F +49 761 386909-10

IHK AWARDS RESEARCH TRANSFER PRIZE 2019

The IHK Research Transfer Award in Silver, valued at 5,000 euros, & was awarded to Elisabeth Warsitz, Franz Binder GmbH & Co. Elektrische Bauelemente KG, Bad Rappenau, Prof. Dr.-Ing. Edgar Dörsam, Institute for Printing Machines and Printing Processes, and Prof. Dr.-Ing. Klaus Hofmann, Department of Integrated Electronic Systems at the  Technical University of Darmstadt. With the ‘ELSE - 3D gravure printing process for electronics’ project, they have researched and applied a process with which functional layers can be applied using an indirect gravure printing process (pad printing). This allows functional layers to be printed on 3D moulds.’

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