The first funding project is working on outstanding issues relating to the functionalisation of surfaces using the direct additive process without an intermediate carrier with the aid of pad printing to expand the current technical limitations.
The functionalisation of surfaces using the direct additive process without an intermediate carrier with the aid of pad printing (binder process) is to be further developed. To this end, the key components such as the printing machine, printing mould, silicone pad, printing paste and printing process must be further researched and adapted to the challenges of the market.
In the second project, the development of a cost-efficient printing process for the realisation of flexible conductor paths on Kapton film is being driven forward as an alternative to conventionally manufactured printed circuit boards.
This should optimise the conventional manufacturing process for flex circuit boards, eliminating the need for etching processes. The printed structures should also fit into existing assembly processes.
Another project involves the development of a printing process for the production of homogeneous, segmented heating elements for heating irregular surfaces.
Heating structures for both the medical technology and automotive sectors are to be applied to various substrates using the pad printing process. The aim is to to generate a homogeneous heating element for heating irregular surfaces.
The fourth project is investigating a manufacturing process for strain gauges printed directly onto the component to be measured. The aim is to develop a low-cost strain gauge manufactured using the pad printing process that can be printed directly onto the component on three-dimensional surfaces without bonding. In addition, the contacting for connection to the evaluation electronics is also to be robustly solved using printing processes.